Our G6E-1KTMS™ Epoxy is a single component epoxy system that is developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-1KTMS™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions.
High Thermal Conductivity (1.8 W/m·K): Our adhesive ensures efficient heat transfer from the heat-generating component to the heat sink or other thermal management components. It helps in dissipating heat quickly, preventing thermal issues like overheating and performance degradation.
Graphene Loaded: a defining feature of the G6E-1KTMS™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.
Long working time: The system cures at 150°C/302°F in 30-40 minutes. It does not cure at room temperature (25°C / 77°F), so it has an unlimited working time and there is no need for it to be stored frozen.
No Mixing Required: As the name suggests, one-component adhesives consist of just one part, meaning there's no need for mixing before application. This makes them user-friendly and less error-prone than two-part or multi-component adhesives that require accurate mixing of the components.
Strong Electrical Resistance: Strong electrical resistance is a crucial characteristic for thermal conductive adhesives, especially in electronic applications. It prevents electrical short circuits and maintains the electrical integrity of the assembly.
Great Mechanical Properties: A thermal conductive adhesive with excellent mechanical properties can withstand thermal expansions, mechanical stresses, and environmental conditions without compromising the bond's integrity.
SPECIFICATIONS OF UNCURED MATERIAL:
ONE COMPONENT SYSTEM: smooth light gray paste.
DENSITY: 1.3-1.4 g/cm3
VISCOSITY: 60 to 80 Pa·s @ 25°C / 77°F
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 1 hour @ 120°C / 248°F or 30 min @ 150°C / 302°F
SPECIFICATIONS OF CURED MATERIAL:
THERMAL CONDUCTIVITY: 1.8 W/m·K
GLASS TRANSITION TEMPERATURE (Tg): 78°C / 172°F
FLEXURAL MODULUS: 4-6 GPa at 25°C
LOSS MODULUS: 210- 280 MPa at 25°C
HARDNESS, SHORE: >75 D
STORAGE & SHELF LIFE: 4 months @ 25°C / 77°F or up to 6 months @ 0°-10°C/32°F in unopened, unmixed containers. No freezing or dry ice required
MIXING INSTRUCTIONS: Stir the epoxy before use.
SAFETY & HANDLING: Always read the SDS before use. Use the product with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove it from the skin.
PACKAGING: Product can be also packaged in various sizes and units to accommodate customer's requirements.
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