Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the bonding and adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSAL™ Epoxy is formulated with a blend of proprietary nanomaterials, additives and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSAL™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more resilient and capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond.
Low Viscosity: our adhesive has a relatively thin consistency, making it easier to apply and spread evenly over the surfaces to be bonded. This property allows for better coverage and reduces the chances of air entrapment, ensuring improved thermal contact between the bonded components.
Thermal Conductivity (1.8 W/m·K): Our adhesive ensures efficient heat transfer from the heat-generating component to the heat sink or other thermal management components. It helps in dissipating heat quickly, preventing thermal issues like overheating and performance degradation.
Graphene Loaded: Graphene is a two-dimensional material known for its excellent mechanical and thermal properties.
Room Temperature/Oven Curable: Room temperature curing is suitable for applications where heating may not be feasible or where components may be sensitive to high temperatures. Oven curing provides faster and more controlled curing conditions, allowing for efficient production processes.
Strong Electrical Resistance: Strong electrical resistance is a crucial characteristic for thermal conductive adhesives, especially in electronic applications. It prevents electrical short circuits and maintains the electrical integrity of the assembly.
Great Mechanical Properties: A thermal conductive adhesive with excellent mechanical properties can withstand thermal expansions, mechanical stresses, and environmental conditions without compromising the bond's integrity.
Electronic Assembly, Thermal Interface Materials (TIMs), Solar panels, Aerospace and Aviation, Automotive Applications, LED Lighting and Medical Devices
SPECIFICATIONS OF UNCURED MATERIAL:
TWO COMPONENT SYSTEM: Part A – smooth gray paste. Part B – smooth white paste
MIX RATIO: 2 (Part A) to 1 (Part B) by weight.
POT LIFE: 2-3 hours
DENSITY: PART A: 0.9-1.0 g/cm3 PART B: 0.9-1.1 g/cm3
CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 24 hours @ 25°C / 77°F or
3 hours @ 80°C / 176°F
45 min @ 150°C / 302°F
MIXED VISCOSITY: 40 to 50 Pa·s @ 25°C / 77°F
SPECIFICATIONS OF CURED MATERIAL:
THERMAL CONDUCTIVITY: 1.8 W/m·K
GLASS TRANSITION TEMPERATURE (Tg): 64°C / 147°F (cured at 80°C/176 °F)
FLEXURAL MODULUS: 6-9 GPa at 25°C
LOSS MODULUS: 280- 380 MPa at 25°C
HARDNESS, SHORE: >70 D
STORAGE & SHELF LIFE: 12 months at 25°C/77°F in unopened, unmixed containers. Stores and ships at room temperature. No freezing or dry ice required
MIXING INSTRUCTIONS: Add Part B to Part A in a separate container and mix slowly until uniform. Vacuum degassing is recommended.
SAFETY & HANDLING: Always read the SDS for both Part A and Part B before use. Use the product with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove it from the skin.
PACKAGING: Part A and Part B (packaged in individual jars). Product can be also packaged in various sizes and units to accommodate customer's requirements.
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